Amphenol Communications Solutions SMD Prototyping IC Socket

High density, high speed, discrete contact, array connector Flexible ground distribution optimizes high speed signal integrity 10Gb/s differential pair performance with under 1% cross-talk 28Gb/s high speed performance documented for 4 mm and 6 mm stack height Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market 1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility 6 PCB Stack heights: 4 mm to 14mm 8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform High density standard BGA attachment lower assembly costs by using standard SMT processes BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage Patented BGA contact attachment preserves solder ball positioning Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free