Hirose 20-Contact Male Interface Module, 500mA

1.27mm pitch High Density I/O connector27mm (0.050″) contact spacing conserves valuable board space and permits ultra-high density designs. Bellows contacts create smooth and precise mating and unmating.Unique shell design assures first make/last break grounding and overall noise protection.IDC termination allows quick and low cost termination to AWG #28 wires. Backshell and receptacle shell are made of diecast zinc alloy or stainless steel to reduce the penetration of external EMI noise. Ferrite added to DX Right Angle Dip Type for EMI Protection is available. Overmold backshell provided for ESD protection is available in One-Touch locking and Screw locking. Termination methods and available in IDC, Solodering, Right Angle Dip, Straight Dip and SMT.