OverviewAt a glanceTough device design Several housing materials and electrical outputs available Immune to deposit formation Commissioning without filling Process temperature up to 250 °C Very hig...
OverviewAt a glanceFlow sensor for conductive and non-conductive liquids Compact design with no moving parts Process temperature up to 80 °C, process pressure up to 16 bar High chemical resistance ...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceTough device design Several housing materials and electrical outputs available Immune to deposit formation Commissioning without filling Process temperature up to 250 °C Very hig...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCompact sensor from 1″ thread Monoprobe design prevents bulk materials from sticking or jamming Polished monoprobe for food applications Commissioning without filling and medium ...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCompact sensor from 1″ thread Monoprobe design prevents bulk materials from sticking or jamming Polished monoprobe for food applications Commissioning without filling and medium ...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceCommissioning without container filling or medium calibration Immune to deposit formation Process temperature up to 150 °C Two electrical output versions and IO-Link available Pi...
OverviewAt a glanceSwitchable switching outputs (PNP/NPN) and analog output (current/voltage) Scalable analog output (5:1 turn down) High measurement accuracy: ± 0.5% IO-Link for transmitting proce...